SHENZHEN JIEXINGDA ELECTRONIC CO., LIMITED

FR4 mutilayers PCB(7)
mutilayers PCB(1)

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heat-sink pcb
Specification: Max.thickness of Base: 8mm
Detail: Board name ; Heat-sink PCB Metal base£» Cu£¬Al. Max.thickness of Base: 8mm Technology: Pre-bonding,post-bonding,Sweat-solder Base copper Surface Treatment£» Plating gold,Ag,Anodize

hd microvia pcb
Specification: Minium Line width/Space 4/4mil
Detail: Board name ; HD microvia PCB Material £» FR4(TG170) Micro-via Structure: 2+C+2 Minium Line width/***ce 4/4mil Technology: Double side,Multi-layer

heavy copper pcb
Specification: ¡¶2.4mm,tolerance 0.1-0.2mm
Detail: Board name ; Heavy copper PCB MAX. copper thickness£» 5OZ Board thickness : ¡¶2.4mm,tolerance 0.1-0.2mm Board thickness : ¡·2.4mm,tolerance¡À8%

embedded component pcb
Specification: 18"X24¡®
Detail: Board name ; Embedded component PCB Embedded component£» Buried capacitance,Embedded resistance Maximum Layer : 10 layers MAX size : 18"X24¡® Technology: HDI+embedded capacitance,Embedded resistance

rigid flex pcb
Specification: 800mm*650mm
Detail: Board name ; Rigid flex PCB Maximum Layer : 16 layers MAX.board thickness ; 2.4mm MAX size : 800mm*650mm Maximum Aspect ratio: 10:01 Minium Line width/***ce 6mil/6mil Finish : HASL,ENIG,Immersion Tin,OSP, Artwork£» mult...

high frequency pcb
Specification: Rogers 3000-6000
Detail: Board name ; High frequency PCB Material £» Rogers 3000-6000 Taconic: RF-#,TLX,TLY,TLC.TSM,TLG,TPG ARLON: AD#,Diclad,Cuclad6700,CLTE,25FR,25N Nelco: N4000-13SI.N4000-12SI

line card pcb
Specification: 24layers
Detail: Board name ; Line card PCB Maximum Layer : 24 layers Minium Line width/***ce inner layer 3mil/3mil otuer layer 4mil/4mil Impedance control: 50-1005

backplane pcb
Specification: 800mm*650mm
Detail: Board name ; Backplane PCB Maximum Layer : 34 layers MAX.board thickness ; 6mm MAX size : 800mm*650mm Maximum Aspect ratio: 10:01


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